The invention relates to the technical field of automation control in the semiconductor manufacturing process and particularly relates to a piece of SECS/GEM message exchange equipment which is used in communication between semiconductor equipment and a host. The SECS/GEM message exchange equipment comprises a configuration file manager, an equipment-end SECS/GEM driver, an equipment message buffer, a host-end SECS/GEM driver, a host message buffer and a transponder. The invention further relates to a SECS/GEM message exchange method. By the adoption of the equipment and the method of the invention, one piece of semiconductor equipment can be connected with a plurality of hosts and is enabled to simultaneously communicate with a plurality of hosts, thus increasing the message exchange rate and improving the production efficiency; effective decoupling can be carried out in the case of a plurality of upper systems, which enables the coupling degree of the systems to be the minimum and facilitates system maintenance; and the pressure of an EAP system is reduced and the time delay of the upper systems in data receiving is shortened.
SECS/GEM message equipment and method
Technical field
The present invention relates to the technical field of automatic control in semiconductor fabrication, relate in particular to communicating by letter between semiconductor equipment and mainframe, a kind of SECS(Semiconductor Equipment Communication Standard specifically, semiconductor equipment communication standard)/GEM(Generic Equipment Model, common apparatus model) message equipment and method.
Background technology
SECS/GEM, HSMS(High-speed SECS Message System, high-speed SECS message system) be by SEMI(Semiconductor Equipment and Materials Institute, semiconductor equipment and materials association) the Semicon industry communication standard protocol formulated, most semiconductor equipments are all in accordance with this agreement at present, operate in the EAP(Equipment Automation Program on the mainframe (Host), equipment automatization program) system communicates by this agreement and equipment, realize and revise device parameter, assign instruction, etc., thereby control appliance operation, also can collect metric data, equipment alarm, etc.
But common CIM(Computer Integrated Manufacturing, computer integrated manufacturing system) upper system (as FDC, APC, SPC, RMS, MES, etc.) need to collect a large amount of real-time data from equipment, but due to SECS, HSMS is a point-to-point communication protocol, so the current scheme is to be all connected to collect data with semiconductor equipment by EAP system substantially, and reports and submits to the upper system, there is following defect in this scheme:
1 - EAP system pressure is very large, may cause system operation slowly, thereby impact is produced;
2 - the data delay that upper system is received, has a certain risk to production;
3 - all upper systems all depend on EAP system, and when the EAP system breaks down, all upper systems all cannot be worked;
4 - because all upper systems all depend on EAP system, the height between this system is coupled and makes troubles to system maintenance
5 - for some early-stage FAB(wafer factories), may cannot find the source code of EAP, EAP is as same camera bellows, cannot revise, but owing to being point-to-point communication, the equipment can only be communicated by letter with a peripheral system, if increase new upper system (as FDC, etc.), almost cannot realize.
SECS/GEM message equipment and method
Technical field
The present invention relates to the technical field of automatic control in semiconductor fabrication, relate in particular to communicating by letter between semiconductor equipment and mainframe, a kind of SECS(Semiconductor Equipment Communication Standard specifically, semiconductor equipment communication standard)/GEM(Generic Equipment Model, common apparatus model) message equipment and method.
Background technology
SECS/GEM, HSMS(High-speed SECS Message System, high-speed SECS message system) be by SEMI(Semiconductor Equipment and Materials Institute, semiconductor equipment and materials association) the Semicon industry communication standard protocol formulated, most semiconductor equipments are all in accordance with this agreement at present, operate in the EAP(Equipment Automation Program on the mainframe (Host), equipment automatization program) system communicates by this agreement and equipment, realize and revise device parameter, assign instruction, etc., thereby control appliance operation, also can collect metric data, equipment alarm, etc.
But common CIM(Computer Integrated Manufacturing, computer integrated manufacturing system) upper system (as FDC, APC, SPC, RMS, MES, etc.) need to collect a large amount of real-time data from equipment, but due to SECS, HSMS is a point-to-point communication protocol, so the current scheme is to be all connected to collect data with semiconductor equipment by EAP system substantially, and reports and submits to the upper system, there is following defect in this scheme:
1 - EAP system pressure is very large, may cause system operation slowly, thereby impact is produced;
2 - the data delay that upper system is received, has a certain risk to production;
3 - all upper systems all depend on EAP system, and when the EAP system breaks down, all upper systems all cannot be worked;
4 - because all upper systems all depend on EAP system, the height between this system is coupled and makes troubles to system maintenance
5 - for some early-stage FAB(wafer factories), may cannot find the source code of EAP, EAP is as same camera bellows, cannot revise, but owing to being point-to-point communication, the equipment can only be communicated by letter with a peripheral system, if increase new upper system (as FDC, etc.), almost cannot realize.
