Monday, July 29, 2019

Smart Manufacturing in Semiconductor Manufacturing

Semiconductor Manufacturing covers various aspects of manufacturing, which includes wafer manufacturing, chip manufacturing, and product manufacturing.

Wafer Manufacturing includes building electronic circuitry layers on a Wafer.
Chip Manufacturing involves probing and testing.

Product Manufacturing involves the final IC assembling and final testing.

Semiconductor manufacturing is not only challenging but also very complicated production system that involves huge capital investment and advanced technology. Semiconductor product fabrication requires sophisticated control on quality, variability, yield, and reliability.

The most important process in Semiconductor Manufacturing is to automate all the processes. This Automation will make the process sequence and its respective parameter settings more accurate and effective and will also ensure that all the fabs various activities integration are more efficient & reliable.


Automation and integration are the two most important keys to success in modern semiconductor manufacturing.



Let’s talk about challenges in Automation and Integration in the Semiconductor Industry.

Automation has a very important role in the daily operations of semiconductor manufacturing.

Need for Automation in Semiconductor Manufacturing Industry aroused for the reasons which are common to most of the industries which opted for automation. And the reasons leading to automation were to make the process faster, more uniform output, replace humans in processes which could involve working in a hazardous environment

The ultimate goal of automation in semiconductor manufacturing is to eliminate human intervention in fab operations. Fab operations can be broadly classified as Manual, Semi-Automated and Fully Automated.

Manual Mode of operations also knows as a traditional model that does not use any computer assistance in fab tools is very scarce to find in today’s commercial fabs.


Semi-Automated operations still prevail in some 6- and 8-in fabs where processing tools are automated and controlled by computers, but the movement of materials to and from the tools is still handled by fab operators.

Automation in semiconductor manufacturing has to provide the complete state of the art to drive the operations of semiconductor fabrication processes, in which layers of materials are deposited on substrates, doped with impurities, and patterned using photolithography to generate integrated circuits(IC).

Automation in the semiconductor industry adopts the hierarchical machine control architecture that facilitates quick adaptability into current fabrication facilities. In this architecture, the lower level of the hierarchy includes embedded controllers to provide real-time control and analysis of fabrication equipment where sensors are installed for monitoring and characterization. At the higher-level, more complex, context- a dependent combination of processor metrology operations or materials movements are handled, sequenced, and executed.

Cluster tools are used by Contemporary semiconductor manufacturers. Each of these consists of several single-wafer processing chambers, for diverse semiconductor fabrication processes, shorter cycle time, faster process development, and a better yield with less contamination.

Semiconductor manufacturing integration involves- allocation, coordination, and mediation among system dynamics and flows of information, command, control, communication, and materials, in a timely and effective way. Due to the ever-increasing complexity of semiconductor devices and their manufacturing processes, Computer Integrated Systems (CIM) are essential for the smooth integration of semiconductor manufacturing. However, CIM systems generally are loosely coupled, monolithic, and difficult to support the ever-changing needs.

Due to various challenges in Semiconductor Manufacturing Integration, like the emergence of a new application, distributed systems, and data integrity, Researchers and Practitioners are working continuously towards building an integrated framework with common, modular and flexible mode to handle most critical issues in semiconductor manufacturing integration.